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Three-dimensional integrated circuit

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Three-dimensional integrated circuit

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Deformation behavior of nanoporous polycrystalline silver layers sintered by low temperature bonding: experiment and simulation

Progress on femtosecond laser-based system-materials: three-dimensional monolithic electrostatic micro-actuator for optomechanics

Graphene quantum capacitors for high-Q tunable LC-tanks for RF ICs

Statistical Fault Injection for Impact-Evaluation of Timing Errors on Application Performance

Statistical Fault Injection for Impact-Evaluation of Timing Errors on Application Performance

Ultra Low Voltage Synthesizable Memories: A Trade-Off Discussion in 65 nm CMOS

A 4.1 pJ/b 25.6 Gb/s 4-PAM Reduced-State Sliding-Block Viterbi Detector in 14 nm CMOS

Implementation of Low-Power 6–8 b 30–90 GS/s Time-Interleaved ADCs With Optimized Input Bandwidth in 32 nm CMOS

Selective Trapping of DNA Using Glass Microcapillaries

Methodology for 3-D Substrate Network Extraction for SPICE Simulation of Parasitic Currents in Smart Power ICs

Statistical Fault Injection for Impact-Evaluation of Timing Errors on Application Performance

Statistical Fault Injection for Impact-Evaluation of Timing Errors on Application Performance

Selective Trapping of DNA Using Glass Microcapillaries

Deformation behavior of nanoporous polycrystalline silver layers sintered by low temperature bonding: experiment and simulation

Ultra Low Voltage Synthesizable Memories: A Trade-Off Discussion in 65 nm CMOS

A 4.1 pJ/b 25.6 Gb/s 4-PAM Reduced-State Sliding-Block Viterbi Detector in 14 nm CMOS

Methodology for 3-D Substrate Network Extraction for SPICE Simulation of Parasitic Currents in Smart Power ICs

Graphene quantum capacitors for high-Q tunable LC-tanks for RF ICs

Progress on femtosecond laser-based system-materials: three-dimensional monolithic electrostatic micro-actuator for optomechanics

Implementation of Low-Power 6–8 b 30–90 GS/s Time-Interleaved ADCs With Optimized Input Bandwidth in 32 nm CMOS