Cooling

Summary

Cooling is removal of heat, usually resulting in a lower temperature and/or phase change. Temperature lowering achieved by any other means may also be called cooling. The transfer of thermal energy may occur via thermal radiation, heat conduction or convection. Examples can be as simple as reducing temperature of a coffee. Devices *Coolant *Cooling towers, as used in large industrial plants and power stations *Daytime passive radiative cooler *Evaporative cooler *Heat exchanger *Heat pipe *Heat sink *HVAC (Heating, Ventilation and Air Conditioning) *Intercooler *Radiative cooling in Heat shields *Radiators in automobiles *Pumpable ice technology *Thermoelectric cooling *Vortex tube, as used in industrial spot cooling

Official source

https://en.wikipedia.org/wiki/Cooling

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Thermal designers of data centers and server manufacturers are showing a greater concern regarding the cooling of the new generation data centers, which consume considerably more electricity and dissipate much more waste heat, a situation that is creating a re- thinking about the most effective cooling systems for the future beyond conventional air cooling of the chips/servers. Potentially, a significantly better solution is to make use of on- chip two-phase cooling, which, besides improving the cooling performance at the chip level while also consuming less energy to drive the cooling process, also adds the capability to reuse the waste heat in a convenient manner, since higher evaporating and condensing temperatures of the two-phase cooling system (from 60-95 °C) are possible with such a new “green” cooling technology. In the present thesis, three such two-phase cooling cycles using micro-evaporation technology were experimentally evaluated with specific attention being paid to (i) controllability of the two-phase cooling system, (ii) energy consumption and (iii) overall exergetic efficiency, with the emphasis on (i). The controllers were evaluated by tracking and disturbance rejection tests, which were shown to be efficient and effective. The average temperatures of the chips were maintained below the upper limit of 85 °C of computer CPU’s for all tests evaluated in steady state and transient conditions. In general, simple SISO and SIMO strategies were sufficient to attain the requirements of control. Regarding energy and exergy analyses, the experimental results showed that all these systems can be thermodynamically improved since only about 6% of the exergy supplied is in fact recovered in the condenser in the present setup. Additionally, a series of tests covering a wide range of operating conditions under steady state regime were done. The main idea was to generate a “map of performance” of the different cooling systems in terms of energy consumption, energy recovery at the condenser and heat exchanger performance. A total of 120 tests were done which considered all combinations of the variables involved. Finally, empirical and semi-empirical correlations for overall thermal conductance and performance of all components and piping of all these systems were developed based on the experimental results obtained, which can be used for simulations and validations of potential codes developed to design and/or evaluate performance of cooling systems. An overall energy balance analysis for each system using the correlations developed showed that 99.17% of the experimental data were bounded within ± 10%.

EPFL2012

Two-phase mini-thermosyphon electronics cooling: Dynamic modeling, experimental validation and application to 2U servers

Nicolas Lamaison, Jackson Braz Marcinichen, Chin Lee Ong, John Richard Thome

Gravity-driven cooling systems employing microchannel flow boiling can become a scalable and viable long term solution for the cooling of datacenter servers. In order to design this emerging type of cooling system, a new dynamic simulation tool using interconnected PDEs is described in the first part of the present paper followed by the validation of the modeling for both steady and dynamic regimes using a first-of-a-kind 15 cm-height thermosyphon test bench. A corrected error of 0.4 K was found for 7 different steady-state mean chip temperatures and heat load disturbances were predicted with the same 2-stage process presented here as the experimental results. The code was then used to predict the behavior of a mini-thermosyphon that would fit within the height of a 2U server. Multiple steady-state solutions were found with both stable and unstable operating states. A sensitivity study demonstrated that a 30% increase in the riser internal diameter led to 10-60% increase in the mass flow rate depending on the heat flux. Then, simulations with unbalanced heat loads showed that the flow gets self redistributed into the CPU with the highest heat load, e.g. 1.7 times larger flow rate for a heat flux 3 times larger. Finally, heat load and water coolant flow rate disturbances were also simulated and discussed. (C) 2016 Elsevier Ltd. All rights reserved.

Pergamon-Elsevier Science Ltd2017

Two-Phase Mini-Thermosyphon Electronics Cooling, Part 4: Application to 2U Servers

Nicolas Lamaison, Jackson Braz Marcinichen, Chin Lee Ong, John Richard Thome

This paper is the fourth part of the present study on two-phase mini-thermosyphon cooling. As mentioned in the first three parts, gravity-driven cooling systems using microchannel flow boiling can become a long-term scalable solution for cooling of datacenter servers. Indeed, the enhancement of thermal performance and the drastic reduction of power consumption together with the possibility of energy reuse and the inherent passive nature of the system offer a wide range of solutions to thermal designers. While Part 1 presented the first-of-a-kind low-height microchannel two-phase thermosyphon test results and Parts 2 and 3 showed the system scale steady and dynamic modeling and simulation results associated with this design using our in-house simulator, Part 4 deals here with an end-user application, i.e. the cooling of a 2U server. The dynamic code of Part 3 is used to model the behavior of a mini-thermosyphon that would fit within the height of a 2U server (8.9cm high), while respecting the other geometric constraints (positions of the processors, distance of the processors to the back of the blade, etc.). Thus, the simulated system consists of two parallel multi-microchannel evaporator cold plates on the top of two chips of about 11cm(2), a riser, a common water-cooled micro-condenser at the back of the blade, a liquid accumulator and a downcomer (including the piping branches to/from the two cold plates). First, an analysis of the steady-state operation highlights multiple solutions from which one is stable and one is unstable. Then, the influences of few parameters such as refrigerants, piping diameters, water coolant inlet temperature and flow rates, filling ratio and heat flux are evaluated. Simulations with unbalanced heat loads on the two chips being cooled in parallel then show the desirable flow distribution obtained in such gravity-driven systems. Finally, temporal heat load and water coolant flow rate disturbances are simulated and discussed. Noting all of these numerous influences on optimal mini-thermosyphon operation, the need for a accurate and detailed simulation code, benchmarked versus actual system tests, is seen to be imperative for attaining a good, reliable, robust design.

Ieee2016

Two-Phase Mini-Thermosyphon Electronics Cooling, Part 4: Application to 2U Servers

Nicolas Lamaison, Jackson Braz Marcinichen, Chin Lee Ong, John Richard Thome

Ieee2016

EPFL2012