RADIUS

Summary

Remote Authentication Dial-In User Service (RADIUS) is a networking protocol that provides centralized authentication, authorization, and accounting (AAA) management for users who connect and use a network service. RADIUS was developed by Livingston Enterprises in 1991 as an access server authentication and accounting protocol. It was later brought into IEEE 802 and IETF standards. RADIUS is a client/server protocol that runs in the application layer, and can use either TCP or UDP. Network access servers, which control access to a network, usually contain a RADIUS client component that communicates with the RADIUS server. RADIUS is often the back-end of choice for 802.1X authentication. A RADIUS server is usually a background process running on UNIX or Microsoft Windows. Protocol components RADIUS is an AAA (authentication, authorization, and accounting) protocol that manages network access. RADIUS uses two types of packets to manage the full AAA proce

Official source

https://en.wikipedia.org/wiki/RADIUS

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Mechanical and electrical characterization of Platinum lines used in sensing devices on polyimide foil

Michela Antonella Barbieri, Danick Briand, Jérôme Courbat, Nico de Rooij

The behavior of Pt thin films on polyimide foil was investigated through tensile and bending tests. They aimed at determining the stability of these conductive pathways when subject to deformation. Such films are used for the fabrication of sensors on plastic foils. During these tests, the behavior of 50 down to 5 μm wide Pt lines was optically and electrically characterized. When the foil was bent with a radius of curvature of 2.5 mm (corresponding to a strain of1%), the resistivity of the Pt layer increased by 4.5%. Agauge factor of 4.45 was found. A further reduction of the radius to 1.25 mm (strain of 2%) led to cracks in the Pt film leading to its loss of electrical conductivity during the experiments. However, when the foil went back to its unbent position, the resistance reached almost its initial value. Complete breakdown occurred for radius smaller than 1 mm. Similar results were observed during tensile tests where breakdown occurred between 2 and 3% of elongation.

2010

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We present 2D cantilever arrays for parallel AFM and their fabrication process using a silicon nitride cantilever with molded tip as the base element of the array. They are designed either for (i) force indentation onto living cells and stiffness mapping, or (ii) cell-to-cell adhesion test applications. The former needs the cantilevers with 0.03 N/m and the tip radius 50 – 200 nm. The latter requires 3 N/m and 2500 nm, respectively. The technique to fabricate those cantilever arrays with different specifications, without significantly changing the fabrication process, is the core of this work. The parallel AFM system itself has been developed and presented elsewhere (M. Favre, et al., Journal of Molecular Recognition, vol. 24, pp. 446-452, 2011). To obtain cantilevers with different spring constants from a wafer, V-grooves structures along the cantilevers were introduced in the cantilever design. An analytical model and an FEA simulation confirmed that the spring constant can be varied up to two decades by changing the V-groove depth. To obtain a large tip radius required for cell handling, we developed a mold enlarging/rounding step and obtained a tip with a radius up to 4 μm.

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Two-dimensional cantilever array with varying spring constants and tip radii for life-science applications

Terunobu Akiyama, Nico de Rooij, Sebastian Gautsch, Frédéric Loizeau, André Meister, Peter Vettiger

A fabrication process for realising two-dimensional cantilever arrays for parallel force spectroscopy of biological samples is presented. The parallel optical atomic force microscopy readout system has been developed and presented elsewhere. The arrays are designed either for (i) force-indentation onto living cells to obtain stiffness mapping or (ii) cell adhesion experiments. Both experiments require very different spring constants and tip radii of curvature. The arrays are based on silicon nitride cantilevers with molded tips. The fabrication process includes an advanced molding process and a thermocompression bonding of two silicon wafers. V-groove structures along the cantilevers, which increase the area moment of inertia, were introduced in the cantilever design. This feature enables the fabrication of cantilevers with different spring constants but same footprint from one wafer. An analytical model and experimental results confirmed that the spring constant of the cantilever (200 x 50 x 0.45 mu m) could be increased up to two decades (0.03-5 N/m) by changing the depth of the V-grooves. To realise the large tip radius required for cell adhesion experiments, an enlarging/rounding procedure has been applied to a truncated pyramidal tip mold. With this process, the authors obtained tips with a radius up to 4 mu m.

2012