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Modern high-performance processors employ ther- mal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly rel ...
Continuous development of highly efficient and compact cooling elements are driven by extensive developments of Micro-Electro-Mechanical Systems (MEMS) devices such as microprocessors or micro high-powered laser systems. As microprocessors continue to head ...
In contemporary superscalar microprocessors, issue queue is a considerable energy dissipating component due its complex scheduling logic. In addition to the energy dissipated for scheduling activities, read and write lines of the issue queue entries are al ...
Advances in manufacturing technologies are enabling the development of 3D multi-processor ICs, but heat in 3D stacking can lead to degraded performance due to higher power density, which derives from the placement of computational units and storage compone ...
As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold ...
With increasing power densities, runtime thermal management is becoming a necessity in today’s systems, especially so for highly integrated Multi-Processor Systems-on-Chip (MPSoCs). In this paper, we propose a neural network (NN) based approach to implemen ...
This paper presents a microelectronic emulation approach for high-speed power system computation. First, the problems of existing power system simulators are detailed. This shows that microelectronic emulation is a possible solution for solving the speed p ...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, performance, coolings costs and leakage power. Task migration techniques have been proposed to manage efficiently the thermal distribution in multi-processor ...
The development of compiler-based mechanisms to optimize the thermal profile of large register files to improve the processor reliability has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the thermal ...
Institute of Electrical and Electronics Engineers2010
Personal digital assistants or mobile phones applications are not anymore restricted to multimedia or wireless communications, but have been extended to handle Global Positioning System (GPS) functionalities. Consequently, the growing market of GPS capable ...