Chip carrierIn electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".
Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
Quad flat packageA quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies.
WinChipThe WinChip series was a low-power Socket 7-based x86 processor designed by Centaur Technology and marketed by its parent company IDT. The design of the WinChip was quite different from other processors of the time. Instead of a large gate count and die area, IDT, using its experience from the RISC processor market, created a small and electrically efficient processor similar to the 80486, because of its single pipeline and in-order execution microarchitecture.
CeleronCeleron is a series of low-end IA-32 and x86-64 computer microprocessor models targeted at low-cost personal computers, manufactured by Intel. The first Celeron-branded CPU was introduced in April 15, 1998, and was based on the Pentium II. Celeron-branded processors released from 2009 to 2022 are compatible with IA-32 software. They typically offer less performance per clock speed compared to flagship Intel CPU lines, such as the Pentium or Core brands. They often have less cache or intentionally disabled advanced features, with variable impact on performance.
AthlonAthlon is the brand name applied to a series of x86-compatible microprocessors designed and manufactured by AMD. The original Athlon (now called Athlon Classic) was the first seventh-generation x86 processor and the first desktop processor to reach speeds of one gigahertz (GHz). It made its debut as AMD's high-end processor brand on June 23, 1999. Over the years AMD has used the Athlon name with the 64-bit Athlon 64 architecture, the Athlon II, and Accelerated Processing Unit (APU) chips targeting the Socket AM1 desktop SoC architecture, and Socket AM4 Zen microarchitecture.
Intel 80286The Intel 80286 (also marketed as the iAPX 286 and often called Intel 286) is a 16-bit microprocessor that was introduced on February 1, 1982. It was the first 8086-based CPU with separate, non-multiplexed address and data buses and also the first with memory management and wide protection abilities. The 80286 used approximately 134,000 transistors in its original nMOS (HMOS) incarnation and, just like the contemporary 80186, it could correctly execute most software written for the earlier Intel 8086 and 8088 processors.
Pentium (original)The Pentium (also referred to as P5, its microarchitecture, or i586) is a fifth generation, 32-bit x86 microprocessor that was introduced by Intel on March 22, 1993, as the very first CPU in the Pentium brand. It was instruction set compatible with the 80486 but was a new and very different microarchitecture design from previous iterations. The P5 Pentium was the first superscalar x86 microarchitecture and the world's first superscalar microprocessor to be in mass productionmeaning it generally executes at least 2 instructions per clock mainly because of a design-first dual integer pipeline design previously thought impossible to implement on a CISC microarchitecture.
