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Concept
Chip carrier
Summary
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.
Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are proprietary to one or two manufacturers. Sometimes the term "chip carrier" is used to refer generically to any package for an integrated circuit.
Types of chip-carrier package are usually referred to by initialisms and include:
BCC: Bump chip carrier
CLCC: Ceramic leadless chip carrier
Leadless chip carrier (LLCC): Leadless chip carrier, contacts are recessed vertically.
LCC: Leaded chip carrier
LCCC: Leaded ceramic chip carrier
DLCC: Dual lead-less chip carrier (ceramic)
PLCC: Plastic leaded chip carrier
PoP: Package on package
A plastic-leaded chip carrier (PLCC) has a rectangular plastic housing. It is a reduced cost evolution of the ceramic leadless chip carrier (CLCC).
A premolded PLCC was originally released in 1976, but did not see much market adoption. Texas Instruments later released a postmolded variant that was soon adopted by most major semiconductor companies. The JEDEC trade group started a task force in 1981 to categorize PLCCs, with the MO-047 standard released in 1984 for square packages and the MO-052 standard released in 1985 for rectangular packages.
The PLCC uses a "J"-lead with pin spacings of 0.05" (1.27 mm).
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