Bonnell is a CPU microarchitecture used by Intel Atom processors which can execute up to two instructions per cycle. Like many other x86 microprocessors, it translates x86 instructions (CISC instructions) into simpler internal operations (sometimes referred to as micro-ops, effectively RISC style instructions) prior to execution. The majority of instructions produce one micro-op when translated, with around 4% of instructions used in typical programs producing multiple micro-ops. The number of instructions that produce more than one micro-op is significantly fewer than the P6 and NetBurst microarchitectures. In the Bonnell microarchitecture, internal micro-ops can contain both a memory load and a memory store in connection with an ALU operation, thus being more similar to the x86 level and more powerful than the micro-ops used in previous designs. This enables relatively good performance with only two integer ALUs, and without any instruction reordering, speculative execution or register renaming. A side effect of having no speculative execution is invulnerability against Meltdown and Spectre.
The Bonnell microarchitecture therefore represents a partial revival of the principles used in earlier Intel designs such as P5 and the i486, with the sole purpose of enhancing the performance per watt ratio. However, Hyper-Threading is implemented in an easy (i.e. low-power) way to employ the whole pipeline efficiently by avoiding the typical single thread dependencies.
On 2 March 2008, Intel announced a new single-core Atom Z5xx series processor (code-named Silverthorne), to be used in ultra-mobile PCs and mobile Internet devices (MIDs), which will supersede Stealey (A100 and A110). The processor has 47 million transistors on a 25 mm2 die, allowing for extremely economical production at that time (~2500 chips on a single 300 mm diameter wafer).
An Atom Z500 processor's dual-thread performance is equivalent to its predecessor Stealey, but should outperform it on applications that can use simultaneous multithreading and SSE3.
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