Publications related to Solder

Hydrogen plasma treatment for improved conductivity in amorphous aluminum doped zinc tin oxide thin films

Christophe Ballif, Aïcha Hessler-Wyser, Quentin Thomas Jeangros, Sylvain Nicolay, Monica Morales Masis, Laura Ding, Fabien Paul Jacques Dauzou

Improving the conductivity of earth-abundant transparent conductive oxides (TCOs) remains an important challenge that will facilitate the replacement of indium-based TCOs. Here, we show that a hydrogen (H-2)-plasma post-deposition treatment improves the co ...

Amer Inst Physics2014

Aging in the relaxor and ferroelectric state of Fe-doped (1-x)(Bi1/2Na1/2)TiO3-xBaTiO3 piezoelectric ceramics

Dragan Damjanovic

Aging of piezoelectric properties was investigated in lead-free (1 - x)(Bi1/2Na1/2)TiO3-xBaTiO(3) doped with 1at.% Fe. The relaxor character of the un-poled material prevents macroscopic aging effects, while in the field-induced ferroelectric phase aging p ...

American Institute of Physics2014

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

John Botsis, Joël Cugnoni, Milad Maleki

The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of the whole solder. The main scope of this study is to deve ...

Elsevier2013

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Christian Leinenbach, Shan Jin

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...

Springer2013

Time-Resolved X-Ray Microtomography Observation of Intermetallic Formation Between Solid Fe and Liquid Al

Michel Rappaz, Cécile Hébert, Aïcha Hessler-Wyser, Guillaume Pasche

Time-resolved in situ X-ray tomography combined with scanning electron microscopy was performed on an Al-Fe diffusion system at 973 K (700 A degrees C) to study the formation of the main intermetallic compounds occurring at the interface. After nucleation ...

Springer US2013

New In-Pd mechanical loss peak in ternary gold alloys

Daniele Mari, Robert Schaller, Iva Tkalcec Vâju

A point defect relaxation peak has been observed in a ternary 18-carat gold alloy with the composition Au62.5Pd32.5In5. It shows a Curie Weiss dependence on the temperature, as is commonly observed for a Zener peak. However, the peak is absent in the binar ...

Pergamon-Elsevier Science Ltd2013

Dynamics of capillary self-alignment for mesoscopic foil devices

Jürgen Brugger, Massimo Mastrangeli

We report experimental evidence for three sequential, distinct dynamic regimes in the capillary self-alignment of centimeter-sized foil dies released at large uniaxial offsets from equilibrium. We show that the initial transient wetting regime, along with ...

American Institute of Physics2013

Dendritic Growth Morphologies in Al-Zn Alloys-Part I: X-ray Tomographic Microscopy

Michel Rappaz, Jonathan Friedli, Paolo Di Napoli

Upon solidification, most metallic alloys form dendritic structures that grow along directions corresponding to low index crystal axes, e.g., directions in fcc aluminum. However, recent findings[1,2] have shown that an increase in the zinc content in Al-Zn ...

Springer Verlag2013

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Solder

Hydrogen plasma treatment for improved conductivity in amorphous aluminum doped zinc tin oxide thin films

Aging in the relaxor and ferroelectric state of Fe-doped (1-x)(Bi1/2Na1/2)TiO3-xBaTiO3 piezoelectric ceramics

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Interaction between liquid aluminium and solid iron Al-rich intermetallics formation

Time-Resolved X-Ray Microtomography Observation of Intermetallic Formation Between Solid Fe and Liquid Al

New In-Pd mechanical loss peak in ternary gold alloys

Dynamics of capillary self-alignment for mesoscopic foil devices

Dendritic Growth Morphologies in Al-Zn Alloys-Part I: X-ray Tomographic Microscopy

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Graph Chatbot

Chat with Graph Search

Time-Resolved X-Ray Microtomography Observation of Intermetallic Formation Between Solid Fe and Liquid Al

Hydrogen plasma treatment for improved conductivity in amorphous aluminum doped zinc tin oxide thin films

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Aging in the relaxor and ferroelectric state of Fe-doped (1-x)(Bi1/2Na1/2)TiO3-xBaTiO3 piezoelectric ceramics

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Dynamics of capillary self-alignment for mesoscopic foil devices

New In-Pd mechanical loss peak in ternary gold alloys

Dendritic Growth Morphologies in Al-Zn Alloys-Part I: X-ray Tomographic Microscopy

Interaction between liquid aluminium and solid iron Al-rich intermetallics formation