Concept

Zen 3

Related publications (16)

Die-Stacked DRAM Caches for Servers: Hit Ratio, Latency, or Bandwidth? Have It All with Footprint Cache

Recent research advocates using large die-stacked DRAM caches to break the memory bandwidth wall. Existing DRAM cache designs fall into one of two categories — block-based and page-based. The former organize data in conventional blocks (e.g., 64B), ensurin ...

ACM2013

Investigation of InGaN/GaN quantum wells for polariton laser diodes

Nicolas Grandjean, Jean-François Carlin, Raphaël Butté, Jacques Levrat, Gatien Cosendey, Georg Rossbach, Marlene Glauser, Munise Nevin Cobet

III-nitride based microcavities (MCs) appear as one of the most promising candidates for the realization of room temperature (RT) polariton laser diodes. The present work focuses on the properties of low In content InGaN/GaN multiple quantum wells (MQWs) i ...

V C H Publishers, Suite 909, 220 E 23Rd St, New York, Ny 10010 Usa2012

Design and Analysis of NoCs for Low-Power 2D and 3D SoCs

Giovanni De Micheli, Luca Benini, Srinivasan Murali, Ciprian Seiculescu

Networks-on-Chip (NoC), being a system-level interconnect, can play a major role in achieving low-power SoC designs. In many designs, the cores are grouped in to Voltage Islands (VIs). To reduce the leakage power consumption, an island containing cores tha ...

Springer New York2011

Enhanced Curie temperature and nonvolatile switching of ferromagnetism in ultrathin (Ga,Mn)As channels

Nava Setter, Igor Stolichnov, Harry Joseph Trodahl, Sebastian Riester, Evgeny Mikheev

The integration of ferroelectric polymer gates on a Mn-doped GaAs magnetic channel provides a promising route for the persistent field-effect control of magnetic properties in high-quality diluted magnetic semiconductors (DMSs) that are otherwise incompati ...

2011

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

David Atienza Alonso, Yusuf Leblebici, Arvind Raj Mahankali Sridhar, José Luis Ayala Rodrigo, Vinod Pangracious

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communica ...

Springer2009

On the lateral decomposition, growth mode and defect nucleation in the InxGa1-xAs channel of HEMT devices depending on the growth temperature, well thickness and mismatch

Marcel Py

We have investigated by TEM InAlAs/InGa1-xAs/InP heterostructures grown by Molecular Beam Epitaxy. Our interest has been focused on the effects of the growth temperature tin the range T-g=470 degrees C-->530 degrees C), well composition (x(In)=53%-->80%) a ...

Donecker, J; Rechenberg, I1998

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