Lecture
This lecture covers the fundamentals of top-down engineering and bottom-up self-assembly, focusing on stencil lithography and thermal scanning probe lithography. It discusses resolution limits in lithography, electron-sample interactions, nanostencil lithography challenges and opportunities, as well as examples of early works in nanostenciling. The presentation also explores dynamic stenciling, nanostenciling on free-standing substrates, and the fabrication of metallic nanostructures using stencil lithography. Additionally, it delves into the process of closed-loop lithography, the unique capabilities of thermal scanning probe lithographies, and the versatility of nanocutting techniques for 2D materials and electronic devices.