Solid Ground Curing: Principles and Examples

This lecture covers the Solid Ground Curing (SGC) process, where a 3D part is built layer by layer out of a photoresist, selectively consolidated by a UV flash passing through a mask. The intelligence of the process lies in the masks made by xerography. The lecture explains the consolidation mechanism, advantages, and disadvantages of SGC compared to other processes like SLA. It also delves into the UV-LIGA process chain, detailing the production of sacrificial shape tools using UV lithography. The advantages, disadvantages, and examples of parts obtained through UV-LIGA are discussed, along with the MICROFABRICA process for fabricating non-cylindrical structures.