3D Integration: Evolution and Applications

This lecture delves into the evolution and applications of 3D integration, discussing the reasons driving its adoption, such as processor to memory system enhancement and heterogeneous integration benefits. The lecture explores various 3D integration technologies, including through silicon vias and monolithic integration, highlighting challenges like partitioning designs and temperature constraints. It also touches on the potential of 3D integration in sensor systems, showcasing a prototype implant for real-time chemical sensing. The lecture concludes by discussing the societal impact of cyber-physical systems, emphasizing the importance of ubiquitous connectivity, novel materials like nanowires, and hybridization of technologies for future advancements.