This lecture explores the evolution of micro and nanoengineering, focusing on the use of silicon as a mechanical material for sensors and transducers. It delves into the advancements in silicon processing techniques and the development of multi-material micro/nanosystems. The presentation covers the manufacturing of next-generation micro/nanosystems, including top-down and bottom-up approaches, and the application of various gentle methods such as capillary assembly of nanoparticles and inkjet printed gas sensors. The lecture also discusses the principles and applications of Atomic Force Microscopy (AFM) and Thermal Scanning Probe Lithography (T-SPL) in nanoengineering, showcasing examples of nanoprobes, nanopatterning, and nanocutting of 2D materials.