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Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is ...
Springer US2009
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2007
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The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...
