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Yüksel Temiz

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Related publications (19)

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Yüksel Temiz

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Post-cmos processing and 3d integration based on dry-film lithography

Design and characterization of micromachined sensor array integrated with CMOS based optical readout

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

A 0.18 mu m Biosensor Front-End Based on 1/f Noise, Distortion Cancelation and Chopper Stabilization Techniques

3D Integration Technology for Lab-on-a-Chip Applications

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Fabrication and characterization of wafer-level deep TSV arrays

A Comparative Study on Fabrication Techniques for On-Chip Microelectrodes