Person
Giulia Beanato
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Related publications (7)
Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.
Impact of Data Serialization over TSVs on Routing Congestion in 3D-Stacked Multi-Core Processors
Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato
3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...
Elsevier2016Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs
Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Kiarash Gharibdoust, Giulia Beanato
This paper presents a circuit-level design and analysis of high-data-rate 3D serial vertical links which exploit the high bandwidth provided by TSV technology. As most of the existing TSVs consume a large amount of die area, the serial configuration can sa ...
Elsevier2016Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication
Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato
3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...
2014