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Global interconnect design for threedimensional integrated circuits is a crucial task. Despitethe importance of this task, limited results related to global issues have been presented. Challenges in reliably distributing power, ground, and the clock signal ...
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approach is compared with two other techniques based on conventional methods used ...
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequential order, the size of the vertical contacts is similar to traditional contac ...
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (TSVs) in most of the manufacturing techniques for three-dimensional (3-D) cir ...
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