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Somayyeh Rahimian Omam

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Related publications (8)

Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.

Signaling in 3-D integrated circuits, benefits and challenges

Somayyeh Rahimian Omam

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuit ...

EPFL2015

A Study on Buffer Distribution for RRAM-based FPGA Routing Structures

Giovanni De Micheli, Xifan Tang, Pierre-Emmanuel Julien Marc Gaillardon, Somayyeh Rahimian Omam

Compared to Application-Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) provide reconfigurablity at the cost of lower performance and higher power consumption. Exploiting a large number of programmable switche ...

IEEE2015

Parallel vs. Serial Inter-plane communication using TSVs

Giovanni De Micheli, Yusuf Leblebici, Somayyeh Rahimian Omam

3-D integration is a promising prospect for implementing high performance multifunctional systems-on- chip. Through Silicon Vias (TSVs) are the enablers for achieving high bandwidth paths in inter-plane communications. TSVs also provide higher vertical lin ...

2014