Full wafer integration of NEMS on CMOS by nanostencil lithography
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Increased flexibility of patterning methods is important for the engineering of multimaterial and multifunctional nano/micro-electro-mechanical systems (NEMS/MEMS), such as polymer-based electronic and sensor devices, 3D microfluidic systems, and bio-analy ...
Inductive proximity sensors are widely used for the contactless measurement of object or target displacement and position in numerous technical products and systems. They are found in various application domains such as transportation, robots, assembly lin ...
Main stream bulk CMOS and the variants of silicon-on-insulator (SOI) CMOS technologies are discussed with respect to testing for the quiescent current of mixed-signal integrated SOI circuits. The 2-3 times lower static power consumption in fully depleted C ...
A new fully integrated 2D micro-fluxgate magnetometer is presented. This magnetometer is integrated in a standard CMOS process and uses a ferromagnetic core integrated on the chip by a photolithographic post process compatible to the integrated circuit tec ...
A new fully integrated 2D micro-fluxgate magnetometer is presented. This magnetometer is integrated in a standard CMOS process and uses a ferromagnetic core integrated on the chip by a photolithographic post-process compatible with the integrated circuit t ...
Modern applications in industry, navigation and medicine demand small and sensitive magnetic field sensors. In this thesis we have developed a new planar micro fluxgate magnetometer. High resolution, low power consumption and orthogonal fields detection ma ...