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Combined Al-protection and HF-vapour release process for ultrathin cantilevers

Related publications (218)

Organic Pentacene Thin Film Transistors on Flexible Substrates Fabricated by Stencil Lithography

This thesis presents the fabrication and characterization of organic thin film transistors (TFTs) on flexible polymer substrates and the development of compliant stencil lithography to significantly improve the patterning resolution on full-wafer scale. Po ...

EPFL2010

Wafer-Scale Fabrication of Thin SiN Membranes and Au Films and Membranes with Arrays of Sub-um Holes Using Nanosphere Lithography

Mona Julia Katharina Klein

In this thesis, the wafer-scale fabrication of SiN membranes, Au films and Au membranes with arrays of sub-µm holes is described. Two conceptually different processes (1) and (2) were developed, both of which are based on nanosphere lithography (NSL) with ...

EPFL2010

Epitaxial piezoelectric MEMS on silicon

Nico de Rooij, Danick Briand, Pattanaphong Janphuang, Don Isarakorn

This paper reports on the microfabrication and characterization of piezoelectric MEMS structures based on epitaxial Pb(Zr0.2Ti0.8)O-3 (PZT) thin films grown on silicon wafers. Membranes and cantilevers are realized using a sequence of microfabrication proc ...

Institute of Physics2010

Micro-Channel Plate Detectors Based on Hydrogenated Amorphous Silicon

Christophe Ballif, Sylvain Dunand, Matthieu Despeisse, François Eric Powolny

A new type of micro-channel plate detector based on hydrogenated amorphous silicon is proposed which overcomes the fabrication and performance issues of glass or bulk silicon ones. This new type of detectors consists in 80-100 μm thick layers of amorphous ...

2010

Method for fabricating micromirror for barcode reader, involves forming holes having diameter less than width of arms on both side of micromirror and wafer and on edges of region separating wafer and micromirror by etching arms

Philippe Renaud, Faouzi Khechana, Nicolas Abelé

A method for fabricating a micromirror in a wafer, including the steps of: depositing and etching layers forming two arms; etching the wafer such that in the back face only a thin portion of the wafer remains in the region of formation of the micromirror a ...

2010

3D stacked arrays of fins and nanowires on bulk silicon

Mihai Adrian Ionescu, Cyrille Hibert, Matthieu Bopp

The development of a particular etching recipe involving two sequences of a Deep Reactive Ion Etching followed by an isotropic etching step for the realization of 3D stacked arrays of fins and nanowires on bulk silicon is reported. Such a recipe can be use ...

Elsevier2010

Biomolecule Patterning on Analytical Devices: A Microfabrication-Compatible Approach

Guillaume Suarez

The present work describes a methodology for patterning biomolecules on silicon-based analytical devices that reconciles 3-D biological functionalization with standard resist lift-off techniques. Unlike classic sol gel approaches in which the biomolecule o ...

2010

Inexpensive and fast wafer-scale fabrication of nanohole arrays in thin gold ﬁlms for plasmonics

Jürgen Brugger, Harry Heinzelmann, Mona Julia Katharina Klein, Bernard Wenger, Raphaël Pugin

In this paper, a fast and inexpensive wafer-scale process for the fabrication of arrays of nanoscale holes in thin gold ﬁlms for plasmonics is shown. The process combines nanosphere lithography using spin-coated polystyrene beads with a sputter-etching pro ...

Institute of Physics2010

Reversed processing of dry photoresist: application to the encapsulation of chemical sensors

Nico de Rooij, Danick Briand, Jérôme Courbat

A generic method for the reverse processing of dry photoresist is proposed. The technique is based on the lamination of pre-patterned polymeric structures on the pre-existing devices. The concept is illustrated with the encapsulation at the foil level of g ...

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2010

Physicochemical and Electrochemical Properties of Etched GaP(111)A and GaP(111)B Surfaces

Blake William Erickson

The observable chemical, electrochemical, and morphological features of GaP(111) surfaces after wet chemical etching have been assessed using X-ray photoelectron spectroscopy, atomic force microscopy, and electrochemical impedance spectroscopy. HF(aq), NH4 ...

2010

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