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All-stencil transistor fabrication on 3D silicon substrates

Jürgen Brugger, Cyrille Hibert, Philippe Langlet, Cristina Martin Olmos, Andreea Veronica Savu, Katrin Sidler Arnet, Oscar Vazquez Mena, Peter Vettiger, Luis Guillermo Villanueva Torrijo

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps—implantation, etching and metallization—using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors.

Iop Publishing Ltd2012

High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

Daniel Grogg, Marion Hermersdorf, Cyrille Hibert, Mihai Adrian Ionescu

This paper reports on the fabrication of sub-micron trenches on silicon-on-insulator (SOI) required in many MEMS devices and on bulk silicon. Trenches in the range of 100-500 nm had been etched with the deep reactive ion etching (DRIE) by using the SHARP (super high aspect ratio process) [1] optimized Bosch process with low frequency (LF) biased substrate. For comparison, the same trenches were etched with reactive ion etching (RIE) based on chlorine chemistry and with the radio frequency (RF) biased substrate DRIE SHARP optimized Bosch process. The comparison clearly illustrates the superiority of the LF biased substrate Bosch process. Aspect ratios of over 20 were achieved with nearly 90 angled and smooth sidewalls. It was found out that the scalloping effect got reduced by decreasing trench width. 200 nm and 150 nm comb-trenches with 200 nm and 150 nm spacing respectively and with an aspect ratio of over 20 were fabricated to demonstrate the controllability and repeatability of the trenches fabrication. (C) 2011 Elsevier B.V. All rights reserved.

2011

Two-Dimensional MEMS Stage Integrated With Microlens Arrays for Laser Beam Steering

David Bowman, Sertan Kutal Gökce, Cyrille Hibert, Sven Holmström

A novel microelectromechanical stage with one uniaxial set of combs capable of 2-D actuation is presented. A polymer microlens array (MLA) is mounted vertically onto the stage. Driven at resonance, the stage deflects 124 mu m out of plane and 34 mu m in plane. Finally, laser beam steering is demonstrated using two cascaded MLAs.

Institute of Electrical and Electronics Engineers2011