Publication

Bio-inspired cellular machines

Related publications (35)

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Michail Zervas, Yusuf Leblebici, Yassir Madhour, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

On the physical consistency between three-dimensional and one-dimensional models in haemodynamics

Alfio Quarteroni, Christian Vergara, Luca Formaggia

In this work we discuss the reliability of the coupling among three-dimensional (3D) and one-dimensional (1D) models that describe blood flowing into the circulatory tree. In particular, we study the physical consistency of the 1D model with respect to the ...

Academic Press Inc Elsevier Science2013

Towards Multi-Fabric 3D Integration Architectures

Panagiotis Athanasopoulos

The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...

EPFL2012

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Hu Xu

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated se ...

EPFL2012

Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

Fengda Sun

The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis ...

EPFL2011

A traveling wave decelerator for neutral polar molecules

Andreas Osterwalder

Recently, a decelerator for neutral polar molecules has been presented that operates on the basis of macroscopic, three-dimensional, traveling electrostatic traps [A. Osterwalder, S. A. Meek, G. Hammer, H. Haak, and G. Meijer, Phys. Rev. A 81, 051401 (2010 ...

American Institute of Physics2011

The Cloud Will Change Everything

James Richard Larus

Cloud computing is fast on its way to becoming a meaningless, oversold marketing slogan. In the midst of this hype, it is easy to overlook the fundamental change that is occurring. Computation, which used to be confined to the machine beside your desk, is ...

2011

Towards an Autonomous Evolution of Non-Biological Physical Organisms

Francesco Mondada, Michael Bonani, Stéphane Magnenat, Roderich Gross, Lorenz Küchler

We propose an experimental study where simplistic organ- isms rise from inanimate matter and evolve solely through physical interactions. These organisms are composed of three types of macroscopic building blocks floating in an agitated medium. The dynamis ...

Springer Verlag2011

Reliability in the Dark Silicon Era

Babak Falsafi

Information technology is now an indispensable pillar of a modern-day society, thanks to the proliferation of digital platforms in the past several decades. The demand on robust and economical data processing and storage, however, is growing faster than te ...

IEEE Computer Soc Press, Customer Service Center, Po Box 3014, 10662 Los Vaqueros Circle, Los Alamitos, CA 907202011

SunFloor 3D: A Tool for Networks on Chip Topology Synthesis for 3D Systems on Chips

Giovanni De Micheli, Luca Benini, Srinivasan Murali, Ciprian Seiculescu

Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient network on chip (NoC) interconnect for a 3-D SoC that meets not only the applicat ...

2010

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