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Technology scaling improves the energy, performance, and area of the digital circuits. With further scaling into sub-45nm regime, we are moving toward very low supply (VDD) and threshold voltages (VT), smaller VDD/VT ratio, high leakage current, and large ...
In three-dimensional (3D) integrated circuits, the effect of process variations on clock skew differs from 2D circuits. The combined effect of inter-die and intra-die process variations on the design of 3D clock distribution networks is considered in this ...
The invention of the integrated circuit and the manufacturing progress as well as continuing progress in the manufacturing process are the fundamental engines for the implementation of all technologies that support today's information society. The vast maj ...
One of the biggest challenges that are facing the Very Large Scale Integrated Circuits (VLSI) technologies today is the significant performance gap (3× to 9×) between full custom circuits and Application Specific Integrated Circuits (ASICs) designed in the ...
In the last forty years the semiconductor industry focused on the downscaling process of the CMOS (Complementary Metal-Oxide-Semiconductor) technology, trying to follow as much as possible the empirical Moore's Law. In the last five years this trend has be ...
Wireless communications are showing an explosive growth in emerging consumer and military applications of radiofrequency (RF), microwave, and millimeter-wave circuits and systems. Applications include wireless personal connectivity (Bluetooth), wireless lo ...
Power density and energy dissipation of digital IC's has become one of the main concerns during the recent years. With the increased usage of battery powered devices, ubiquitous computing, and increase in implantable biomedical applications, enhancing ener ...
The recently proposed PIMOS transistor can offer, by appropriate operation, non-hysteretic abrupt off-on transitions due to impact ionization if the action of its parasitic bipolar transistor is minimized. This work proposes non-hysteretic abrupt inverter ...
As embedded computing evolves towards ever more powerful architectures, the challenge of properly interconnecting large numbers of on-chip computation blocks is becoming prominent. Networks-on-Chip (NoCs) have been proposed as a scalable solution to both p ...
The paper deals with Hall and flux-gate magnetic field sensors consisting of integrated combination of CMOS ASICs and planar ferromagnetic components. Ferromagnetic parts are made of a soft amorphous alloy, integrated at the CMOS wafer in a post-processing ...