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Anomalies on V-I characteristic of NbTi cable-in-conduit conductors

Related publications (33)

Three-Dimensional FDTD-Based Simulation of Induced Surges in Secondary Circuits Owing to Primary-Circuit Surges in Substations

Currently, plenty of sensitive electronic devices are installed in secondary circuits in substations and power plants. Electronic devices may malfunction and become damaged owing to electromagnetic disturbances caused mainly by lightning surges. To protect ...

2021

Experimental investigation and analysis of sequential jet impingement concepts for enhanced turbine cooling

Michele Gaffuri

With the future decarbonization of the electricity production, gas turbines will be an important tool for the stabilization of the electricity grid by meeting the peak of energy demand using zero-carbon fuels like synthetic gas and hydrogen.The combustion ...

EPFL2021

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We present an electromagnet combining a large number of windings in a constrained volume with efficient cooling. It is based on bulk copper where a small pitch spiral is cut out and impregnated with epoxy, forming an ensemble which is then machined at will ...

2019

Evaluating the electricity saving potential of electrochromic glazing for cooling and lighting at the scale of the Swiss non-residential national building stock using a Monte Carlo model

Jean-Louis Scartezzini, Andreas Schueler, Olivia Valérie Charlotte Bouvard

Novel electrochromic glazing technology has been identified as an emerging option for reducing cooling and lighting electricity demand. As this technology is particularly promising for office building we assess the related technical energy saving potential ...

2019

Synthesis of Heat-Integrated Water Allocation Networks: A Meta-Analysis of Solution Strategies and Network Features

François Maréchal, Ivan Daniel Kantor, Maziar Kermani

Industries consume large quantities of energy and water in their processes which are often considered to be peripheral to the process operation. Energy is used to heat or cool water for process use; additionally, water is frequently used in production supp ...

2018

Insulation effect on thermal stability of Coated Conductors wires in liquid nitrogen

Bertrand Dutoit

Superconducting wires are not perfectly homogeneous in term of critical current as well as stabilization. In resistive fault current limiter applications this could lead to hot spots if the fault current is only slightly above the nominal current of the de ...

Iop Publishing Ltd2017

An important challenge for the next generation of high performance datacenters is to guarantee sufficient, reliable, green and cheap cooling of the server blades. Since this seems unrealistic with air cooling technologies due to the expected ever higher ch ...

EPFL2014

Fault Location in Multi-Terminal HVDC Networks Based on Electromagnetic Time Reversal with Limited Time Reversal

Mario Paolone, Reza Razzaghi

This paper aims at proving the application of the fault location method based on the Electromagnetic Time Reversal (EMTR) to multi-terminal HVDC (MTDC) networks. In particular, the paper integrates the EMTR fault location technique with the protection sche ...

Wroclaw University of Technology2014

A Combined Sensor Placement and Convex Optimization Approach for Thermal Management in 3D-MPSoC with Liquid Cooling

Giovanni De Micheli, David Atienza Alonso, Francesco Zanini

Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly relev ...

Elsevier Science Bv2013

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Ayse Kivilcim Coskun, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

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