Publication

Transport properties of water and glycol in an ultra high performance fiber reinforced concrete (UHPFRC) under high tensile deformation

Related publications (40)

Elastic limit tensile stress of UHPFRC: Method of determination and effect of fiber orientation

Eugen Brühwiler, Emmanuel Denarié, Jian Zhan

This paper discusses the influence of fiber orientation on elastic limit tensile stress of ultra-high performance fiber reinforced cementitious composites (UHPFRC). An original model relating elastic limit tensile stress to fiber orientation is proposed, a ...

2023

Influence of water on deformation and failure of gypsum rock

Alexandra Roma Larisa Kushnir

While water is known to significantly reduce the strength of rocks, there remains a paucity of data on water-weakening of gypsum. Here, we quantify water-weakening in a natural gypsum facies from Monferrato (Italy) by performing experiments on nominally dr ...

2022

Effect of water on sandstone's fracture toughness and frictional parameters: Brittle strength constraints

Marie Estelle Solange Violay, Corentin Jean-Marie Rémi Noël

Water presence causes a dramatic reduction of sandstone strength. Under compressive stress conditions, the strength of a rock sample is controlled by frictional parameters and the fracture toughness of the material. Here, we report fracture toughness, fric ...

2021

Influence of thermo-mechanical history on the ordering kinetics in 18 carat Au alloys

Helena Van Swygenhoven, Steven Van Petegem, Nadine Baluc, Marina Garcia Gonzalez

Precious alloys are subjected to a series of mechanical and thermal operations during manufacturing. For 18 carat gold alloys the processing operations can induce L1(0) ordered nanodomains, known to lead to the buildup of residual stresses, which are the p ...

PERGAMON-ELSEVIER SCIENCE LTD2020

Microstructure evolution of stainless steel subjected to biaxial load path changes: In-situ neutron diffraction and multi-scale modeling

Helena Van Swygenhoven

The lattice strain and intensity evolution obtained from in-situ neutron diffraction experiments of 316L cruciform samples subjected to 45 degrees and 90 degrees load path changes are presented and predicted using the multi-scale modeling approach proposed ...

PERGAMON-ELSEVIER SCIENCE LTD2019

Nanoscale Depth Profiling of Residual Stresses Due to Fine Surface Finishing

Joris Pierre Everaerts

Mechanical polishing is commonly used for both surface finishing and metallographic sample preparation for a broad range of materials. However, polishing causes local deformation and induces residual stress, which has an important effect on many surface ph ...

2019

Thermal Activation, Intermittency and Size Effects in the Plastic Deformation of Cast Aluminium Microwires

Suzanne Godelieve Alphonsine Verheyden

The microcasting process is a scaled-down investment casting process in which molten metal is pressure-infiltrated and directionally solidified in water-soluble moulds. It was previously developed to produce metallic microwires with a diameter (D) between ...

EPFL2018

Investigations and numerical modeling of mechanical properties of tempered martensitic steel Eurofer97 at various loading rates, temperatures and after spallation irradiation

Serafin Knitel

The reduced activation tempered martensitic steel Eurofer97 is a reference steel for a structural applica-tions in fusion reactors. The first-wall and blanket materials will be subjected to high thermal and neutron fluxes and will experience very complex, ...

EPFL2018

Atomistic simulation of the elongation response of a < 011 > oriented columnar nano-grain bcc Fe polycrystalline sample

The tensile elongation of an < 011 > oriented columnar nanocrystalline pure iron structure at a temperature of 300 K has been simulated by molecular dynamics (MD). The simulated sample contains 4.3 x 10(6) atoms and has been subject to free elongation alon ...

Springer2016

Deformation behavior of nanoporous polycrystalline silver layers sintered by low temperature bonding: experiment and simulation

Saba Zabihzadeh

Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...

EPFL2016

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