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Prediction of the adhesive fillet size for skin to honeycomb core bonding in ultra-light sandwich structures

Related publications (32)

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Atomic bonding effects in annular dark field scanning transmission electron microscopy. I. Computational predictions

Matteo Cococcioni

Annular dark field scanning transmission electron microscopy (ADF-STEM) image simulations were performed for zone-axis-oriented light-element single crystals, using a multislice method adapted to include charge redistribution due to chemical bonding. Exami ...

American Vacuum Society2016

Anisotropic transport properties of tungsten disulfide

László Forró, Richard Gaal, Helmuth Berger, Bálint Náfrádi, Andrea Pisoni, Jacim Jacimovic

Single crystals of WS2 were prepared by chemical vapor transport method using sulfur as a transport agent. Measurements of electrical resistivity, Seebeck coefficient and thermal conductivity as a function of temperature, along the in-plane and the out-of- ...

Pergamon-Elsevier Science Ltd2016

A 3D moving mesh Finite Element Method for two-phase flows

John Richard Thome, Navid Borhani, Gustavo Rabello Dos Anjos

A 3D ALE Finite Element Method is developed to study two-phase flow phenomena using a new discretization method to compute the surface tension forces. The computational method is based on the Arbitrary Lagrangian-Eulerian formulation (ALE) and the Finite E ...

Elsevier2014

One central aim of nanotechnology is the creation and exploitation of nanostructured materials with pre-programmed architecture and properties. The fabrication of functional nanostructures relies on versatile protocols of synthetic chemistry enabling the p ...

EPFL2012

Soudure par interdiffusion dans les systèmes Au-In et In-Ni

Léa Deillon

Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...

EPFL2012

Low-temperature indium hermetic sealing of alkali vapor-cells for chip-scale atomic clocks

Nico de Rooij, Danick Briand, Yves Pétremand

We present a low-temperature indium hermetic bonding technique on wafer level without using flux, active atmosphere or other pretreatment of the indium. Its simplicity and low temperatures allow encapsulation of sensitive MEMS devices. Bonding stronger tha ...

IEEE2012

Low temperature pyrex/silicon wafer bonding via a single intermediate parylene layer

Martinus Gijs, Ata Tuna Ciftlik

We introduce a new low temperature (280 °C) parylene-C wafer bonding technique, where parylene-C bonds directly a Pyrex wafer to a silicon wafer with either a Si, SiO2 or Si3N4 surface with a bonding strength up to 23 MPa. The technique uses a single layer ...

IEEE2011

With increasing computer capabilities, numerical modeling of two-phase flows has developed significantly over the last few years. Although there are two main categories, namely 'one' fluid and 'two' fluid methods, the 'one' fluid methods are more commonly ...

EPFL2010

A method for separating and recovering silicon debris from sawing waste is characterized in that it comprises the following steps: - treating the sawing waste so as to deoxidize the silicon debris in a manner that reduces their surface energy, - applying t ...

2009

Self-assembled monolayer (SAM) films have attracted immense attention for both fundamental and applied research. A SAM is composed of a large number of molecules with a head group that chemisorbs onto a substrate, a tail group that interacts with the outer ...

EPFL2007