Power managementPower management is a feature of some electrical appliances, especially copiers, computers, computer CPUs, computer GPUs and computer peripherals such as monitors and printers, that turns off the power or switches the system to a low-power state when inactive. In computing this is known as PC power management and is built around a standard called ACPI, this supersedes APM. All recent computers have ACPI support.
Die (integrated circuit)A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies, and die.
Variable Specific Impulse Magnetoplasma RocketThe Variable Specific Impulse Magnetoplasma Rocket (VASIMR) is an electrothermal thruster under development for possible use in spacecraft propulsion. It uses radio waves to ionize and heat an inert propellant, forming a plasma, then a magnetic field to confine and accelerate the expanding plasma, generating thrust. It is a plasma propulsion engine, one of several types of spacecraft electric propulsion systems. The VASIMR method for heating plasma was originally developed during nuclear fusion research.
Flow process chartThe flow process chart is a graphical and symbolic representation of the activities performed on the work piece during the operation in industrial engineering. The first structured method for documenting process flow, e.g., in flow shop scheduling, the flow process chart, was introduced by Frank and Lillian Gilbreth to members of ASME in 1921 as the presentation "Process Charts, First Steps in Finding the One Best Way to Do Work". The Gilbreths' tools quickly found their way into industrial engineering curricula.
Electrodeless plasma thrusterThe electrodeless plasma thruster is a spacecraft propulsion engine commercialized under the acronym "E-IMPAcT" for "Electrodeless-Ionization Magnetized Ponderomotive Acceleration Thruster". It was created by Gregory Emsellem, based on technology developed by French Atomic Energy Commission scientist Dr Richard Geller and Dr. Terenzio Consoli, for high speed plasma beam production. The electrodeless plasma thruster is currently being developed and adapted to various spacecraft propulsion needs by The Elwing Company.
Quad flat packageA quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies.
CubeSatA CubeSat is a class of miniaturized satellite based around a form factor consisting of cubes. CubeSats have a mass of no more than per unit, and often use commercial off-the-shelf (COTS) components for their electronics and structure. CubeSats are put into orbit by deployers on the International Space Station, or launched as secondary payloads on a launch vehicle. , more than 1,600 CubeSats have been launched.
