Antenna arrayAn antenna array (or array antenna) is a set of multiple connected antennas which work together as a single antenna, to transmit or receive radio waves. The individual antennas (called elements) are usually connected to a single receiver or transmitter by feedlines that feed the power to the elements in a specific phase relationship. The radio waves radiated by each individual antenna combine and superpose, adding together (interfering constructively) to enhance the power radiated in desired directions, and cancelling (interfering destructively) to reduce the power radiated in other directions.
Plasma propulsion engineA plasma propulsion engine is a type of electric propulsion that generates thrust from a quasi-neutral plasma. This is in contrast with ion thruster engines, which generate thrust through extracting an ion current from the plasma source, which is then accelerated to high velocities using grids/anodes. These exist in many forms (see electric propulsion). However, in the scientific literature, the term "plasma thruster" sometimes encompasses thrusters usually designated as "ion engines".
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Co-fired ceramicCo-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Complex geometryIn mathematics, complex geometry is the study of geometric structures and constructions arising out of, or described by, the complex numbers. In particular, complex geometry is concerned with the study of spaces such as complex manifolds and complex algebraic varieties, functions of several complex variables, and holomorphic constructions such as holomorphic vector bundles and coherent sheaves. Application of transcendental methods to algebraic geometry falls in this category, together with more geometric aspects of complex analysis.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Volta potentialThe Volta potential (also called Volta potential difference, contact potential difference, outer potential difference, Δψ, or "delta psi") in electrochemistry, is the electrostatic potential difference between two metals (or one metal and one electrolyte) that are in contact and are in thermodynamic equilibrium. Specifically, it is the potential difference between a point close to the surface of the first metal and a point close to the surface of the second metal (or electrolyte). The Volta potential is named after Alessandro Volta.
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
Semiconductor deviceA semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum (typically liberated by thermionic emission) or as free electrons and ions through an ionized gas.
Solar electric propulsionSolar electric propulsion (SEP) refers to the combination of solar cells and electric thrusters to propel a spacecraft through outer space. This technology has been exploited in a variety of spacecraft designs by the European Space Agency (ESA), the JAXA (Japanese Space Agency), Indian Space Research Organisation (ISRO) and NASA. SEP has a significantly higher specific impulse than chemical rocket propulsion, thus requiring less propellant mass to be launched with a spacecraft. The technology has been evaluated for missions to Mars.
