Exploring Temperature-Aware Design of Memory Architectures in VLIW Systems
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Modern software applications are growing in complexity and demand very intensive use of data. Therefore, a wide variety of data structures are utilized to facilitate the storage and access to these vast amounts of computed information. Additionally, the ne ...
Instruction Set Extensions (ISEs) can be used effectively to accelerate the performance of embedded processors. The critical, and difficult task of ISE selection is often performed manually by designers. A few automatic methods for ISE generation have show ...
2007
Because the market has an insatiable appetite for new functionality, performance is becoming an increasingly important factor. The telecommunication and network domains are especially touched by this phenomenon but they are not the only ones. For instance, ...
Process variation in future technologies can cause severe performance degradation since different parts of the shared Register File (RF) in VLIW processors may operate at various speeds. In this paper we present a complete approach that handles speed varia ...
Commercial server applications remain memory bound on modern multiprocessor systems because of their large data footprints, frequent sharing, complex non-strided access patterns, and long chains of dependant misses. To improve memory system performance des ...
The register file is one of the hottest devices in processor- based systems. Leakage reduction techniques and DTM mechanisms re- quire a thermal characterization of the hardware. This paper presents a thermal model to analyze the temperature evolution in t ...
Prior research indicates that there is much spatial variation in applications' memory access patterns. Modern memory systems, however, use small fixed-size cache blocks and as such cannot exploit the variation. Increasing the block size would not only proh ...
New applications in embedded systems are becoming Increasingly dynamic. In addition to increased dynamism, they have massive data storage needs. Therefore, they rely heavily on dynamic, run-time memory allocation. The design and configuration of a dynamic ...
ACM/IEEE Press2006
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Achieving the main memory (DRAM) required bandwidth at ac- ceptable power levels for current and future applications is a ma- jor challenge for System-on-Chip designers for mobile platforms. Three dimensional (3D) integration and 3D stacked DRAM mem- ories ...
2012
When it comes to performance, embedded systems share many problems with their higher-end counterparts. The growing gap between top processor frequency and memory access speed, the memory wall, is one such problem. Driven, in part, by low energy consumption ...