On-chip implementation of multiprocessor networks and switch fabrics
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As the complexity of applications grows with each new generation, so does the demand for computation power. To satisfy the computation demands at manageable power levels, we see a shift in the design paradigm from single processor systems to Multiprocessor ...
Field Programmable Gate Arrays (FPGAs) have the unique ability to be configured into application-specific architectures that are well suited to specific computing problems. This enables them to achieve performances and energy efficiencies that outclass oth ...
Ongoing changes in world demographics and the prevalence of unhealthy lifestyles are imposing a paradigm shift in healthcare delivery. Nowadays, chronic ailments such as cardiovascular diseases, hypertension and diabetes, represent the most common causes o ...
Modern society is dependent on reliable electricity for security, health, communication, transportation, finance, computers and nearly all aspects of the contemporary life. Providing reliable electricity is a very complex challenge. It involves real-time m ...
An efficient communications apparatus is described for a vector signaling code to transport data and optionally a clocking signal between integrated circuit devices. Methods of designing such apparatus and their associated codes based on a new metric herei ...
The information revolution of the last decade has been fueled by the digitization of almost all human activities through a wide range of Internet services. The backbone of this information age are scale-out datacenters that need to collect, store, and proc ...
Two diverse manufacturing techniques for building 3-D integrated systems are vertical integration with Through-Silicon-Vias (TSVs), also referred to as 3-D TSV integration, and 3-D monolithic integration. In this paper, we present a hybrid integration sche ...
The advent of 3-D fabrication technology makes it possible to stack a large amount of last-level cache memory onto a multi-core die to reduce off-chip memory accesses and, thus, increases system performance. However, the higher power density (i.e., power d ...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
Heat removal and power density distribution delivery have become two major reliability concerns in 3D stacked technology. In this paper, we propose a thermal-driven 3D floorplanner. Our contributions include: (1) a novel multi-objective formulation to cons ...