Development of novel SU-8 based nanoimprint lithography
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Sub-micron scale lithography methods using deep UV, X-ray or electron beams will allow for further progress in integrated circuit hardware manufacturing. The drawback of these high-end patterning methods however is firstly, the high cost of the equipment, ...
Characterization of the mechanical and thermal properties of the high aspect- ratio, negative, UV resist, SU-S has been carried out. This resist allows for a broad range of thicknesses to be obtained with a single spin process. Standard exposure with a UV ...
A tool and method for flexible and rapid surface patterning technique beyond lithography based on high-resolution shadow mask method, or nanostencil, is presented. This new type of miniaturized shadow mask is fabricated by a combination of MEMS processes a ...
Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single- ...
We present an optical investigation of GaN pillars using both micro-Raman (mu-Raman) and microphotoluminescence (mu-PL) spectroscopy. GaN pillars of diameter ranging from 100 nm to 5 mum were fabricated by electron beam lithography and reactive ion etching ...