Laser soldering of piezoelectric actuator with minimal thermal impact
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In this paper, the stability of a displacement sensor assembled with Sn96 (tin- silver) solder, Sn62 (tin-leadsilver) solder or conductive silver-loaded epoxy glue was compared. In the absence of humidity or thermal cycling, the glue was found to be much b ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...
Curing kinetics of commercial polycarbosilane have been measured using differential scanning calorimetry in air between 140 and 220 degrees C. It was found that the total heat of curing increases linearly with temperature. At constant temperature, the rate ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
Xu et al. have recently published a set of results for boiling heat transfer measurements in a multi- channel micro- scale evaporator for flow boiling of acetone in triangular cross- section channels ( hydraulic diameter of 155.4 mm). In the present collab ...