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Laser soldering of piezoelectric actuator with minimal thermal impact

Related publications (47)

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Thermoeconomic Analysis of a Solar Enhanced Energy Storage Concept Based on Thermodynamic Cycles

Samuel Henchoz

Large scale energy storage may play an increasingly important role in the power generation and distribution sector, especially when large shares of renewable energies will have to be integrated into the electrical grid. Up to now pumped-hydro is the only t ...

Pergamon-Elsevier Science Ltd2011

Heat transfer in Interverterbral Discs (IVDs)

Philippe Abdel Sayed

The Nucleus Pulposus (NP) is an avascular tissue that may be subject to temperature increase. Indeed, since the NP is not perfused by the cardio-vascular system, it implies that heat cannot be convected from it. The sources of heat could be either external ...

2011

Understanding the Thermo-Mechanical Behaviour of Energy Piles

Lyesse Laloui, Alice Di Donna

The heating and cooling of buildings worldwide represent a large amount of the energy needs and are one of the significant sources of CO2. Decreasing the environmental impact of residential and office buildings is of crucial interest. Energy geostructures ...

2011

A Dual-Axis High Fill-Factor Micromirror Array for High Thermal Loads

Nico de Rooij, Caglar Ataman, Wilfried Noell, Fabio Jutzi, Sébastien Lani, Dara Zaman Bayat

A high fill-factor, dual-axis micromirror array with novel spring and actuator design is developed for high thermal load applications. Each pixel can attain an omnidirectional mechanical DC rotation angle of +/- 4 degrees. ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2011

Heat and spin transport in magnetic nanowires

Jean-Philippe Ansermet, Haiming Yu, Simon Granville

Transport measurements are carried out in which temperature oscillation is applied to magnetic nanostructures. Using spin valves, this measurement reveals aspects of the spin transport in non-collinear configurations. In one implementation, an AC voltage i ...

Elsevier2010

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Characterization of the Residual Stresses and Strength of Ceramic-Metal Braze Joints

John Botsis, Matteo Galli

Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...

2009

T0004 / Soldering wires to sensor contact pads

Thomas Maeder

The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...

EPFL2008

Characterization of Interconnects Resulting from Capillary Die-to-Substrate Self-Assembly

Massimo Mastrangeli

Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...

IEEE2008

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008