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Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks

Related publications (55)

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System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

High-energy physics (HEP) experiments and space missions share a common challenge: thermal management in harsh environments. The severe constraints in both fields make cooling of electronic components a major design concern. This thesis aims to develop hig ...

EPFL2021

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This paper advances the work presented at ITHERM 2020 where a novel passive two-phase technology was introduced for more efficient cooling of datacenters compared to air-based cooling solutions (e.g. In-Room, In-Row, etc.). The proposed hybrid two-phase co ...

IEEE2021

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In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

IEEE2020

Co-designing electronics with microfluidics for more sustainable cooling

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Luca Nela, Georgios Kampitsis, Reza Soleiman Zadeh Ardebili

Thermal management is one of the main challenges for the future of electronics1,2,3,4,5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the powe ...

2020

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Benjamin Aaron Helfrecht, Alejandro Strachan

As the challenges in continued scaling of the integrated circuit technology escalate every generation, there is an urgent need to find viable solutions for both the front-end-of-line (transistors) and the back-end-of-line (interconnects). For the interconn ...

AMER INST PHYSICS2020

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Thermal Interface Material Enablement of Off-Board Two-Phase Cooling

John Richard Thome, Raffaele Luca Amalfi

Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components. One barrier to wide spread adoption of two-phase cooling solutions is preserving product features deemed essenti ...

IEEE2018

Power exhaust scenario and divertor design for a steady-state Japan (JA) DEMO and a pulse Europe (EU) DEMO1 have been investigated as one of the most important common issues in Broader Approach DEMO Design Activity. Radiative cooling is a common approach f ...

ELSEVIER SCIENCE SA2018