Beam-steering micromirrors for large optical cross-connects
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Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...
Institut de Microtechnique, Université de Neuchâtel2009
Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...
Amazing and beautiful optical effects are present in Nature. Some examples are the iridescent colors produced by peacocks, butterflies and beetles. While the simulations of some of these structures have already been realized, only a few elements have been ...
Institut de Microtechnique, Université de Neuchâtel2008
In this paper we propose to replace all data and control pads generally present in conventional chips with a new type of ultra-compact, low-power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables optical through-chip bus ...
Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2008
LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...
High temperatures, very high pressures and/or the presence of aggressive media cannot be covered by standard packaging methods, which only provide limited environmental stability. Ceramic technologies such as LTCC (Low Temperature Cofired Ceramic) and thic ...
As dictated by ongoing technology scaling and the advent of multi-core systems, each new generation of microprocessors and digital signal processors provides higher computing power and data throughput. However, the available bandwidth of the input/output ( ...
The present thesis deals with Micro-Electro-Mechanical Systems (MEMS) optical switches for telecommunication applications. The aim is to study new type of microsystems for guided-wave optical switching applications. Two projects have been investigated. The ...
An optically-active multi-layer dielectric structure comprises an optically active zone between two mirrors forming a Fabry-Perot microcavity. The optically active zone comprises an optically active material of wavelength lambda centred in a layer of high ...
In this paper we propose to eliminate all data and control pads generally present in conventional chips and to replace them with a new type of ultra-compact, low power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables en ...