Effects of low and high temperatures on tensile behavior of adhesively-bonded GFRP joints
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Silicon nitride based ceramics (SiAlONs); tetragonal polycrystalline zirconia (3Y‐TZP); alumina and their composites reinforced with different amount of multi‐ walled carbon‐nanotubes (CNTs) have been processed by Spark Plasma Sintering (SPS). High tempera ...
Lake Geneva is recovering from its eutrophic past but no significant trend in the areal hypolimnetic oxygen depletion rate has been observed over the last 30 years. Due to the large depth of 309 m, the lake is not mixed completely every winter which can le ...
The creep properties of a cast gamma-alpha-2 lamellar titanium aluminide of type Ti-46Al-2W-0.5Si (at. %) containing beta-particles was investigated using both helium-implanted and non-implanted material. Creep tests were performed in vacuum under constant ...
Ternary Au-Cu-Pt alloys, of unequal gold and copper atomic contents and containing 2.5 wt.% Pt, are ordered isothermally at 250 or 400 degrees C after annealing at 650 degrees C and quenching in water. The alloys are characterized by transmission electron ...
Welding is an important joining method for the work with metals. During the welding process, the material is heated and deforms plastically which leads a change in microstructure in the heat affected zone, to complex residual stress distributions, and dist ...
The effect of temperature on the crack onset strain (COS) of brittle coatings on polymer substrates was investigated through a series of temperature-controlled tensile tests carried out in situ under an optical microscope. It was observed that the failure ...
This research investigated the evolution of tensile, hardness, and fracture properties of Eurofer97 tempered martensitic steel following neutron irradiation. The irradiation-hardening was measured with Vickers hardness tests on broken parts of sub-sized co ...
This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...
Embrittlement by helium was investigated in a lamellar TiAl alloy under two conditions: Specimens were implanted to various amounts of helium up to 762 appm at temperatures from 630 °C to 1000 °C and some of them subsequently creep-tested at the same tempe ...
Compression experiments were conducted on slender glass fiber-reinforced polymer (GFRP) laminates at different temperatures in the elevated range. Experimental buckling loads, lateral second-order deformations, and shear strength decreased with increasing ...