Gas Sensors on Plastic Foil with Reduced Power Consumption for Wireless Applications
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
Within the framework of a project consisting in developing a haptic keyboard, each key is aimed to be controlled individually in position and force. Small sized actuators has already been designed and integrated in a 64 keys force feedback keyboard. The pr ...
Cutting-edge CMOS neurochips, which consist of a Microelectrode Array (MEA) manufactured on top of CMOS circuitry, allow the recording of the electrical activity of neural networks in-vitro, and their stimulation. As CMOS technology continues to scale down ...
This paper presents a preliminary work on the feeding of an AC dipole using a resonant circuit with a varying resonant frequency. A single phase LC oscillator containing a variable capacitor is fed by a wide band amplifier or a voltage source inverter. For ...
Institute of Electrical and Electronics Engineers2011
Neural networks (NNs) implemented at the transistor level are powerful adaptive systems. They can perform hundreds of operations in parallel but at the expense of a large number of building blocks. In the case of analog realization, an extremely low chip a ...
Institute of Electrical and Electronics Engineers2011
, , ,
The design, fabrication and characterization of Micro-electro-mechanical metal-air-insulator-semiconductor (MEM-MAIS) diode switch are originally reported. An abrupt switching from off-state to Fowler-Nordheim tunneling current in on-state is induced by th ...
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (TSVs) in most of the manufacturing techniques for three-dimensional (3-D) cir ...
ACM Order Department, P.O. Box 64145, Baltimore, MD 21264 USA2009
Based on the results from a field survey campaign, this article describes three new developments which have been integrated to provide a comprehensive basis for the evaluation of overheating risk in offices. Firstly, a set of logistic regression equations ...
In this work, mineral sacrificial pastes (MSP) previously developed for standard thick-film technology (alumina substrates) are extended to LTCC in order to make a capacitive anemometer. Application of MSP materials on free-sintering (unconstrained and not ...
2008
The dielectric, electrical and structural properties of (1-x) (0.94Bi(1/2)Na(1/2)TiO(3)-0.06BaTiO(3))-xK(0.5)Na(0.5)NbO(3) (BNT-BT-xKNN) with x=0.09, 0.12, 0.15, and 0.18 were investigated as potential candidates for high-temperature capacitors with a work ...
American Institute of Physics2011
, , ,
We report on the fabrication of a low cost sensing platform which includes printed / electroplated resistive thermometers and capacitive-based humidity sensors working at ultra low power consumption. Both types of devices were integrated on the same polyme ...
