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0-level Vacuum Packaging RT Process for MEMS Resonators

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Consolidation of net-shape random fiber thermoplastic composite preforms

Véronique Michaud, Patrick Blanchard, Martyn Douglas Wakeman, Simon Jespersen

A novel thermoplastic composite preforming process has been developed. This thermoplastic programmable powdered preforming process (TP-P4) uses commingled glass and polypropylene yarns, which are chopped to a desired length and deposited onto a vacuum scre ...

2010

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

Nanogap MEM resonators on SOI

Nicoleta-Diana Ciressan

Today's consumer electronics based on a large variety of time-keeping and frequency reference applications is based on quartz-crystal oscillators, because of their excellent performances in terms of quality factor, thermal and frequency stability. However, ...

EPFL2009

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Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especia ...

2009

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

Sensors and packages based on LTCC and thick-film technology for severe conditions

Peter Ryser, Thomas Maeder, Caroline Jacq, Hansu Birol, Yannick Sébastien Fournier, Damien Sonney, Raphael Willigens

High temperatures, very high pressures and/or the presence of aggressive media cannot be covered by standard packaging methods, which only provide limited environmental stability. Ceramic technologies such as LTCC (Low Temperature Cofired Ceramic) and thic ...

2007

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Vorrichtung zum Herstellen eines Gasgemisches

Patrik Willi Hoffmann

The invention relates to a device for producing a gas mixture consisting of HMDSO and oxygen, whereby process gas is produced. In order to be able to continuously produce a large volume of process gas using such a device and to be able to withdraw the same ...

Tetra Laval Holdings & Finance2001