Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
PowerPCPowerPC (with the backronym Performance Optimization With Enhanced RISC – Performance Computing, sometimes abbreviated as PPC) is a reduced instruction set computer (RISC) instruction set architecture (ISA) created by the 1991 Apple–IBM–Motorola alliance, known as AIM. PowerPC, as an evolving instruction set, has been named Power ISA since 2006, while the old name lives on as a trademark for some implementations of Power Architecture–based processors.
Semiconductor fabrication plantIn the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. Fabs require many expensive devices to function. Estimates put the cost of building a new fab over one billion U.S. dollars with values as high as 3–4billionnotbeinguncommon.TSMCinvested9.3 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $20 billion. 3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Graphics processing unitA graphics processing unit (GPU) is a specialized electronic circuit initially designed to accelerate computer graphics and (either on a video card or embedded on the motherboards, mobile phones, personal computers, workstations, and game consoles). After their initial design, GPUs were found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. Other non-graphical uses include the training of neural networks and cryptocurrency mining.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
PaperPaper is a thin sheet material produced by mechanically or chemically processing cellulose fibres derived from wood, rags, grasses, or other vegetable sources in water, draining the water through a fine mesh leaving the fibre evenly distributed on the surface, followed by pressing and drying. Although paper was originally made in single sheets by hand, almost all is now made on large machines—some making reels 10 metres wide, running at 2,000 metres per minute and up to 600,000 tonnes a year.
Fab labA fab lab (fabrication laboratory) is a small-scale workshop offering (personal) digital fabrication. A fab lab is typically equipped with an array of flexible computer-controlled tools that cover several different length scales and various materials, with the aim to make "almost anything". This includes technology-enabled products generally perceived as limited to mass production. While fab labs have yet to compete with mass production and its associated economies of scale in fabricating widely distributed products, they have already shown the potential to empower individuals to create smart devices for themselves.
Coated paperCoated paper (also known as enamel paper, gloss paper, and thin paper) is paper that has been coated by a mixture of materials or a polymer to impart certain qualities to the paper, including weight, surface gloss, smoothness, or reduced ink absorbency. Various materials, including kaolinite, calcium carbonate, bentonite, and talc, can be used to coat paper for high-quality printing used in the packaging industry and in magazines. The chalk or china clay is bound to the paper with synthetic s, such as styrene-butadiene latexes and natural organic binders such as starch.
Electrical gridAn electrical grid is an interconnected network for electricity delivery from producers to consumers. Electrical grids vary in size and can cover whole countries or continents. It consists of: power stations: often located near energy and away from heavily populated areas electrical substations to step voltage up or down electric power transmission to carry power long distances electric power distribution to individual customers, where voltage is stepped down again to the required service voltage(s).
