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Concept
Package on a package
Summary
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Two widely used configurations exist for PoP:
Pure memory stacking: two or more memory only packages are stacked on each other
Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.
During PCB assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top.
The packages of a PoP stack become attached to each other (and to the PCB) during reflow soldering.
The package on a package technique tries to combine the benefits of traditional packaging with the benefits of die-stacking techniques, while avoiding their drawbacks.
Traditional packaging places each die in its own package, a package designed for normal PCB assembly techniques that place each package directly on the PCB side-by-side.
The 3D die-stacking system in package (SiP) techniques stacks multiple die in a single package, which has several advantages and also some disadvantages compared to traditional PCB assembly.
In embedded PoP techniques, chips are embedded in a substrate on the bottom of the package. This PoP technology enables smaller packages with shorter electrical connections and is supported by companies such as Advanced Semiconductor Engineering (ASE).
The most obvious benefit is motherboard space savings. PoP uses much less PCB area, almost as little as stacked-die packages.
Official source
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