Publication

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

Related publications (90)

About
Privacy
Disclaimer

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

Graph Chatbot

Chat with Graph Search

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

Towards Multi-Fabric 3D Integration Architectures

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips

A High-throughput and Low-Latency Interconnection Network for Multi-Core Clusters with 3-D Stacked L2 Tightly-Coupled Data Memory

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Towards Cost Effective Multi-Core Processor Platforms Using 3-D Stacking Technology

Thermal Characterization of Cloud Workloads on a Power-Efficient Server-on-Chip

Thermal Modeling and Management of Liquid-Cooled 3D Stacked Architectures