100 mm dynamic stencils pattern sub-micrometre structures
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We propose here an application to sensing of annular aperture arrays (AAA). We theoretically investigate the optical properties of the reflective AAA device when illuminated in-plane. The cavity presents almost perfect absorption due to the waveguide mode ...
Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...
Institut de Microtechnique, Université de Neuchâtel2009
The development of a particular etching recipe involving two sequences of a Deep Reactive Ion Etching followed by an isotropic etching step for the realization of 3D stacked arrays of fins and nanowires on bulk silicon is reported. Such a recipe can be use ...
In this paper, a fast and inexpensive wafer-scale process for the fabrication of arrays of nanoscale holes in thin gold films for plasmonics is shown. The process combines nanosphere lithography using spin-coated polystyrene beads with a sputter-etching pro ...
To improve health, to help to manage chronical disease and to provide equal access to healthcare, continuous monitoring of physiological parameter associated to telemedicine is mandatory. In this perspective Body Sensor Networks concept has emerged. It inc ...
Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 μm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ...
This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...
With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...
Motivated by the fabrication potential of multi-walled carbon nanotube structures, we numerically investigated a paired structure consisting of two metallic spheres each grown on one end of a multi-walled nanotube. The paired two-segmented structure is cap ...
This work was carried out in a collaborative framework between Ecole Polytechnique Fédérale de Lausanne and an industrial partner ST Microelectronics. RF MEMS passives are key devices for the RF front-end in modern transceiver and receiver architectures, o ...