Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Low frequencyLow frequency (LF) is the ITU designation for radio frequencies (RF) in the range of 30–300 kHz. Since its wavelengths range from 10–1 km, respectively, it is also known as the kilometre band or kilometre wave. LF radio waves exhibit low signal attenuation, making them suitable for long-distance communications. In Europe and areas of Northern Africa and Asia, part of the LF spectrum is used for AM broadcasting as the "longwave" band. In the western hemisphere, its main use is for aircraft beacon, navigation (LORAN), information, and weather systems.
Radio frequencyRadio frequency (RF) is the oscillation rate of an alternating electric current or voltage or of a magnetic, electric or electromagnetic field or mechanical system in the frequency range from around 20kHz to around 300GHz. This is roughly between the upper limit of audio frequencies and the lower limit of infrared frequencies. These are the frequencies at which energy from an oscillating current can radiate off a conductor into space as radio waves, so they are used in radio technology, among other uses.
Computational electromagneticsComputational electromagnetics (CEM), computational electrodynamics or electromagnetic modeling is the process of modeling the interaction of electromagnetic fields with physical objects and the environment. It typically involves using computer programs to compute approximate solutions to Maxwell's equations to calculate antenna performance, electromagnetic compatibility, radar cross section and electromagnetic wave propagation when not in free space.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
MotherboardA motherboard (also called mainboard, main circuit board, MB, mboard, backplane board, base board, system board, mobo; or in Apple computers logic board) is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It holds and allows communication between many of the crucial electronic components of a system, such as the central processing unit (CPU) and memory, and provides connectors for other peripherals.
System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
CostIn production, research, retail, and accounting, a cost is the value of money that has been used up to produce something or deliver a service, and hence is not available for use anymore. In business, the cost may be one of acquisition, in which case the amount of money expended to acquire it is counted as cost. In this case, money is the input that is gone in order to acquire the thing. This acquisition cost may be the sum of the cost of production as incurred by the original producer, and further costs of transaction as incurred by the acquirer over and above the price paid to the producer.
MicrowaveMicrowave is a form of electromagnetic radiation with wavelengths ranging from about 30 centimeters to one millimeter corresponding to frequencies between 1000 MHz and 300 GHz respectively. Different sources define different frequency ranges as microwaves; the above broad definition includes UHF, SHF and EHF (millimeter wave) bands. A more common definition in radio-frequency engineering is the range between 1 and 100 GHz (wavelengths between 0.3 m and 3 mm). In all cases, microwaves include the entire SHF band (3 to 30 GHz, or 10 to 1 cm) at minimum.
Radio spectrumThe radio spectrum is the part of the electromagnetic spectrum with frequencies from 3 Hz to 3,000 GHz (3 THz). Electromagnetic waves in this frequency range, called radio waves, are widely used in modern technology, particularly in telecommunication. To prevent interference between different users, the generation and transmission of radio waves is strictly regulated by national laws, coordinated by an international body, the International Telecommunication Union (ITU).
