Etching (microfabrication)Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
Riemann surfaceIn mathematics, particularly in complex analysis, a Riemann surface is a connected one-dimensional complex manifold. These surfaces were first studied by and are named after Bernhard Riemann. Riemann surfaces can be thought of as deformed versions of the complex plane: locally near every point they look like patches of the complex plane, but the global topology can be quite different. For example, they can look like a sphere or a torus or several sheets glued together.
3-manifoldIn mathematics, a 3-manifold is a topological space that locally looks like a three-dimensional Euclidean space. A 3-manifold can be thought of as a possible shape of the universe. Just as a sphere looks like a plane to a small enough observer, all 3-manifolds look like our universe does to a small enough observer. This is made more precise in the definition below. A topological space is a 3-manifold if it is a second-countable Hausdorff space and if every point in has a neighbourhood that is homeomorphic to Euclidean 3-space.
ConnectomeA connectome (kəˈnɛktoʊm) is a comprehensive map of neural connections in the brain, and may be thought of as its "wiring diagram". An organism's nervous system is made up of neurons which communicate through synapses. A connectome is constructed by tracing the neuron in a nervous system and mapping where neurons are connected through synapses. The significance of the connectome stems from the realization that the structure and function of the human brain are intricately linked, through multiple levels and modes of brain connectivity.
Reactive-ion etchingReactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber.
Work hardeningIn materials science, work hardening, also known as strain hardening, is the strengthening of a metal or polymer by plastic deformation. Work hardening may be desirable, undesirable, or inconsequential, depending on the context. This strengthening occurs because of dislocation movements and dislocation generation within the crystal structure of the material. Many non-brittle metals with a reasonably high melting point as well as several polymers can be strengthened in this fashion.
Fiber laserA fiber laser (or fibre laser in Commonwealth English) is a laser in which the active gain medium is an optical fiber doped with rare-earth elements such as erbium, ytterbium, neodymium, dysprosium, praseodymium, thulium and holmium. They are related to doped fiber amplifiers, which provide light amplification without lasing. Fiber nonlinearities, such as stimulated Raman scattering or four-wave mixing can also provide gain and thus serve as gain media for a fiber laser.
Soft matterSoft matter or soft condensed matter is a subfield of condensed matter comprising a variety of physical systems that are deformed or structurally altered by thermal or mechanical stress of the magnitude of thermal fluctuations. These materials share an important common feature in that predominant physical behaviors occur at an energy scale comparable with room temperature thermal energy (of order of kT), and that entropy is considered the dominant factor. At these temperatures, quantum aspects are generally unimportant.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
Thermosetting polymerIn materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (resin). Curing is induced by heat or suitable radiation and may be promoted by high pressure, or mixing with a catalyst. Heat is not necessarily applied externally, but is often generated by the reaction of the resin with a curing agent (catalyst, hardener).
