Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Photovoltaic system performancePhotovoltaic system performance is a function of the climatic conditions, the equipment used and the system configuration. PV performance can be measured as the ratio of actual solar PV system output vs expected values, the measurement being essential for proper solar PV facility's operation and maintenance. The primary energy input is the global light irradiance in the plane of the solar arrays, and this in turn is a combination of the direct and the diffuse radiation.
Timeline of solar cellsIn the 19th century, it was observed that the sunlight striking certain materials generates detectable electric current – the photoelectric effect. This discovery laid the foundation for solar cells. Solar cells have gone on to be used in many applications. They have historically been used in situations where electrical power from the grid was unavailable. As the invention was brought out it made solar cells as a prominent utilization for power generation for satellites.
Thin filmA thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.
Doping (semiconductor)In semiconductor production, doping is the intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million atoms, the doping is said to be low or light.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
Transport layerIn computer networking, the transport layer is a conceptual division of methods in the layered architecture of protocols in the network stack in the Internet protocol suite and the OSI model. The protocols of this layer provide end-to-end communication services for applications. It provides services such as connection-oriented communication, reliability, flow control, and multiplexing. The details of implementation and semantics of the transport layer of the Internet protocol suite, which is the foundation of the Internet, and the OSI model of general networking are different.
Plasma etchingPlasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma.
GrapheneGraphene (ˈgræfiːn) is an allotrope of carbon consisting of a single layer of atoms arranged in a hexagonal lattice nanostructure. The name is derived from "graphite" and the suffix -ene, reflecting the fact that the graphite allotrope of carbon contains numerous double bonds. Each atom in a graphene sheet is connected to its three nearest neighbors by σ-bonds and a delocalised π-bond, which contributes to a valence band that extends over the whole sheet.
Application layerAn application layer is an abstraction layer that specifies the shared communications protocols and interface methods used by hosts in a communications network. An application layer abstraction is specified in both the Internet Protocol Suite (TCP/IP) and the OSI model. Although both models use the same term for their respective highest-level layer, the detailed definitions and purposes are different. In the Internet protocol suite, the application layer contains the communications protocols and interface methods used in process-to-process communications across an Internet Protocol (IP) computer network.