Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
IPhone 4sThe iPhone 4s is a smartphone that was designed and marketed by Apple Inc. It is the fifth generation of the iPhone, succeeding the iPhone 4 and preceding the iPhone 5. It was announced on October 4, 2011, at Apple's Cupertino campus, and was the final Apple product announced in the lifetime of former Apple CEO and co-founder Steve Jobs, who died the following day. Orders could be placed on October 7, 2011, and mainstream availability in retail stores began on October 14, 2011 in the United States, Australia, Canada, the United Kingdom, France, Germany, and Japan.
