Publication

Nanocrystalline metals: transient testing during in situ X-ray diffraction and molecular dynamics

Zhen Sun
2016
EPFL thesis
Abstract

Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary work-hardening followed by an early observation of constant flow stress. Information on possible deformation mechanisms have been gathered by extensive research combining in situ deformation experiments, electron microscopy observations and computational modelling. Generally, these mechanisms are categorized into two types: dislocation slip and grain boundary (GB) accommodation processes, as for instance, GB sliding based mechanisms and GB migration eventually coupled to the shear stress. However, the interplay between these mechanisms resulting in the constant deformation resistance is not fully understood. Transient testing has proven to be a suitable tool to gather information on the rate limiting deformation mechanisms that are activated during the deformation path. In particular in stress reduction experiments, after an intermediate/large stress drop thermally activated dislocation slip is suppressed so that other underlying mechanisms are brought into foreground during subsequent transient creep. Those mechanisms may play a minor role in the determination of the flow stress but might still be essential to the development of a constant deformation resistance. Within this thesis, transient testing is combined with in situ X-ray diffraction at the Swiss Light Source. Therefore, the transient responses are captured in terms of evolution of macrostrain as well as diffraction peak broadening. Since dislocation slip and GB accommodation have an opposite footprint on the peak broadening, the presence of these two types of mechanisms can be distinguished. Three electrodeposited NC materials with different grain sizes are investigated: two NC Ni batches and one NC Ni50Fe50 batch. The results reveal that the constant flow stress reached during uniaxial deformation of electrodeposited NC metals reflects a quasi-stationary balance between dislocation-based mechanisms and GB-mediated accommodation. The latter plays an important role in producing plastic strain and recovering the defects and internal stress. Depending on the magnitude of the stress drop, a non-monotonic behaviour of the diffraction peak width is observed, suggesting an alternation of mechanisms. Also, by comparing transient responses among different NC materials, the relative contributions of dislocation slip and GB accommodation mechanisms are discussed in terms of grain size and alloying. Finally, different magnitudes of stress reduction are carried out by molecular dynamics (MD) simulations with the aim to verify in situ experimental results and explore the mechanisms responsible for GB accommodation. MD simulations confirm that dislocation slip is reduced after a moderate stress drop, however can continue to operate after adaption of the GB structures by a variety of GB accommodation mechanisms explaining the non-monotonic behaviour of the peak broadening during transient creep.

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Related concepts (34)
Dislocation
In materials science, a dislocation or Taylor's dislocation is a linear crystallographic defect or irregularity within a crystal structure that contains an abrupt change in the arrangement of atoms. The movement of dislocations allow atoms to slide over each other at low stress levels and is known as glide or slip. The crystalline order is restored on either side of a glide dislocation but the atoms on one side have moved by one position. The crystalline order is not fully restored with a partial dislocation.
Creep (deformation)
In materials science, creep (sometimes called cold flow) is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point. The rate of deformation is a function of the material's properties, exposure time, exposure temperature and the applied structural load.
Grain boundary strengthening
In materials science, grain-boundary strengthening (or Hall–Petch strengthening) is a method of strengthening materials by changing their average crystallite (grain) size. It is based on the observation that grain boundaries are insurmountable borders for dislocations and that the number of dislocations within a grain has an effect on how stress builds up in the adjacent grain, which will eventually activate dislocation sources and thus enabling deformation in the neighbouring grain as well.
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