Publication

Die Level Release of Silicon Photonic MEMS

Niels Quack, Teodoro Graziosi, Jonas Jacobs
2016
Conference paper

Abstract

We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.

Official source

https://infoscience.epfl.ch/record/224731?ln=en

About this result

This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Die Level Release of Silicon Photonic MEMS

Graph Chatbot

Chat with Graph Search

Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb

Cascaded all-optical quantization employing step-size MMI and shape-optimized power splitter

Low-Voltage Silicon Photonic Mems Switch With Vertical Actuation

Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb

Low-Voltage Silicon Photonic Mems Switch With Vertical Actuation

Cascaded all-optical quantization employing step-size MMI and shape-optimized power splitter