Publication
Sputter Deposition Technology For Al((1-X))Sc(X)N Films With High Sc Concentration
Abstract
Aluminium scandium nitride (Al1-xScxN) with its strongly enhanced piezoelectric response is the upcoming piezoelectric material of choice in next generation RF filters, sensors, actuators and energy harvesting devices. This paper will concentrate on the deposition technology for Al1-xScxN films with high Sc content. Films with Sc concentrations close to 43 at% have been grown on 200-mm substrates using a cluster type sputter deposition tool. The piezoelectric response will be discussed and correlated with the deposition parameters and film structural properties. The steps required to deliver a high-volume production solution for high Sc concentration will be described.
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Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
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Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
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