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A low-cost, actuated passive dynamic walker kit for accessible research and education
Related concepts (24)
Circuit design
The process of circuit design can cover systems ranging from complex electronic systems down to the individual transistors within an integrated circuit. One person can often do the design process without needing a planned or structured design process for simple circuits. Still, teams of designers following a systematic approach with intelligently guided computer simulation are becoming increasingly common for more complex designs.
Computer accessibility
Computer accessibility (also known as accessible computing) refers to the accessibility of a computer system to all people, regardless of disability type or severity of impairment. The term accessibility is most often used in reference to specialized hardware or software, or a combination of both, designed to enable the use of a computer by a person with a disability or impairment. Computer accessibility often has direct positive effects on people with disabilities.
Integrated circuit design
Integrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Processor design
Processor design is a subfield of computer science and computer engineering (fabrication) that deals with creating a processor, a key component of computer hardware. The design process involves choosing an instruction set and a certain execution paradigm (e.g. VLIW or RISC) and results in a microarchitecture, which might be described in e.g. VHDL or Verilog. For microprocessor design, this description is then manufactured employing some of the various semiconductor device fabrication processes, resulting in a die which is bonded onto a chip carrier.